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Magazine Name : Ieee Transactions On Components And Packaging Technologies

Year : 2004 Volume number : 27 Issue: 03

Thermal Management Using Synthetic Jet Ejectors (Article)
Subject: Active Heat Sink , Channel Cooling , Synthetic Jets
Author: Nicolas Rumigny      Ari Glezer     
page:      439 - 444
Esd Protection Design To Overcome Internal Damage On Interface Circuits Of A Cmos Ic With Multiple Separated Power Pins (Article)
Subject: Electrostatic Discharge (Esd) , Esd Protection Circuit , Internal Bond
Author: Ming-Dou Ker      Chyh-Yih Chang      Yi-Shu Chang     
page:      445 - 451
Investigation On Device Characteristic Of Mosfet Transistor Placed Under Bond Pad For High Pin Count Soc Applications (Article)
Subject: Bond Properties , Leakage Current , Temperature Cycling
Author: Ming-Dou Ker      Jeng-Jie Peng     
page:      452 - 460
Flip Chip On Board Assessment Of Reliability In Cellular Phone Application (Article)
Subject: Ball Grid Array , Chip Seal , Printed Circuit Board
Author: Markku Sillanpaa      Juscelino Hozumi Okura     
page:      461 - 467
A Device Transfer Process Selectively Occupied Repeated Transfer Sort For Resource Saving Integration Of Polymer Micro Optics Fabricated By Built In Mask Method (Article)
Subject: Resource Scheduling , Built-In-Self-Test , Multichip Module
Author: Hana Yoshimura      Yukihiko Arai      Kunihiko Asama     
page:      468 - 471
A Study Of Electromigration In 3-D Flip Chip Solder Joint Using Numerical Simulation Of Heat Flux And Current Density (Article)
Subject: Computation Fluid Dynamics , Current Density , Flip-Chip
Author: Tien-Yu Lee      Taek Jung Lee      King-Ning Tu     
page:      472 - 479
Multiobjective Placement Of Electronic Components Using Evolutionary Algorithms (Article)
Subject: Evolutionary Algorithms , Very Large Antennas Arrays , Wire-Lenght
Author: Kalyanmoy Deb      Prateek Jain     
page:      480 - 492
Fill Pattern And Particle Distribution Of Underfill Material (Article)
Subject: Coefficient Of Thermal Expansion (Cte) , Underfill Processing
Author: L. D Huang      Yue Huang      Michael G. Pecht Fellow     
page:      493 - 498
Characterization Of Hygroscopic Swelling Behavior Of Mold Compounds And Plastic Packages (Article)
Subject: Mold Compounds , Chip/Mold Compound Interface , Humidity
Author: Eric Stellrecht      Bongtae Han      Michael G. Pecht     
page:      499 - 506
St (Article)
Subject:
Author:
page:      507 - 512
Simulation And Design For A Tunable Dispersion Compensator Package (Article)
Subject: Thermally Tunable , Numerical Simulation , Dispersion Compensation
Author: Weidong Zhu      Giovanni Barbarossa     
page:      513 - 522
The Influence Of Various Common Assumptions On The Boundary Condition Independence Of Compact Thermal Models (Article)
Subject: Boundary Condition And Clearance , Compact Tension Specimen
Author: C. J. M. Lasance     
page:      523 - 529
Thermal Transient Modeling And Experimental Validation In The European Project Profit (Article)
Subject: Compact Thermal Model , Dual Cold Plte , Transient Thermal Modelling
Author: Heinz Pape      I Schweitzer     
page:      530 - 538
Optimal Design Methodlolgy Of Plate-Fine Heat Sinks For Electronic Cooling Using Using Entropy Generation Strategy (Article)
Subject: Engineering Design , Entropy Generation , Heat Transfer
Author: C. J. Shih      G. C. Liu     
page:      551 - 559
Mechanicbased Solution To Rf Mems Switch Stictch Stiction Problem (Article)
Subject: Actuation Voltage , Reliability , Switch
Author: P. E. Mercado      Tien-Yu Tom Lee     
page:      560 - 54
An Analysis Of Two-Heater Active Thermal Control Technology Fo Device Testing (Article)
Subject: Active Thermography , Thermal Testing , Heat Transfer , Maximum Density
Author: J. W. Wan      W. J. Zhang      David Torvi     
page:      577 - 584
Model For Bga And Csp Relibility In Automotive Underhood Applications (Article)
Subject: Ball Grid Array , Bismaleimide , Plastic Ball Grid Array
Author: Pradeep Lall      Mohd Nokibul Islam      Robert Darveaux     
page:      585 - 593
Full-Field Wafer Level Thin Film Stress Measurement By Phase-Stepping Shadow Moire (Article)
Subject: Phase Stepping , Thin Films , Wafer
Author: Kuo-Shen Chen      I-Kuan Lin      Chia-Cheng Chuang     
page:      594 - 601
Arrhenius Average Temperature The Effective Temperature For Non-Fatigue Wearout And Long Term Reliability In Variable Thermal Conditions And Climates (Article)
Subject: Arrhenius , Thermal Factors , Thermal Applications
Author: Michal Tencer      John Seaborn Moss      Trevor Zapach     
page:      602 - 607
Effects Of Silica Filler And Diuent On Material Properties And Reliability Of Nonconductive Pastes (Ncps) For Flip-Chip Applications (Article)
Subject: Diluent , Filler Size , Thermal Cycle Stability , Flip-Chip
Author: Kyung-Woon Jang      Woon-Seong Kwon     
page:      608 - 615